muse/book-reading-clip-lamp

bill-of-materials.csv

Reference designators,Quantity per product,Assembly location,Description,Manufacturer,Manufacturer part number,Value / electrical requirements,Package / dimensions,Selection status,Footprint / qualification status,Supplier reference,Primary source / design reference,Notes
U1,1,Head PCB,Wi-Fi/BLE microcontroller module,Espressif,ESP32-S3-WROOM-1U-N16R8,16 MB flash; 8 MB Octal PSRAM; 3.3 V; external antenna,18 x 19.2 mm module,Selected for Rev B engineering prototype; hardware qualification pending,Imported copper audited; all 41 labels corrected; pin26 row offset corrected,JLCPCB C3013946,https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf,Do not connect module pins28-30 (PSRAM). External antenna ANT1 required. Nine pin41 lands must connect to ground. Thermal vias/stencil require review.
U2,1,Head PCB,Li-ion charger with power path,Texas Instruments,BQ24074RGTR,1 cell; 4.2 V charge; nominal 500 mA programmed current,VQFN-16 RGT; 3 x 3 mm plus exposed pad,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C54313 import; verify stencil / thermal process,JLCPCB C54313,https://www.ti.com/lit/ds/symlink/bq24074.pdf,Temperature monitored at remote cell. Current can reduce under input or thermal limiting. Board is not battery protection circuitry.
U3,1,Head PCB,3.3 V buck-boost regulator,Texas Instruments,TPS63021DSJR,Fixed 3.3 V output,VSON-14 DSJ; 3 x 4 mm plus exposed pad,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C202140 import with comb exposed pad,JLCPCB C202140,https://www.ti.com/lit/ds/symlink/tps63021.pdf,Comb-shaped exposed ground copper requires stencil and thermal-via review. Validate regulator transient and switch-node layout.
U4,1,Head PCB,Bottom-port I2S microphone,TDK InvenSense,INMP441ACEZ-R7,3.3 V; I2S digital output,4.72 x 3.76 x 1.00 mm LGA,Prototype only; R7 catalog variant obsolete; replacement needed for production,JLCSearch import; acoustic hole and masked ground escape added; obsolete prototype part,JLCPCB C22379536,https://product.tdk.com/en/search/sw_piezo/mic/mems-mic/info?part_no=INMP441,Exact part availability must be confirmed. Acoustic hole/ring stencil and enclosure seal need assembly review. Replacement microphone requires a new footprint/pin audit.
U5,1,Head PCB,I2S mono speaker amplifier,Analog Devices / Maxim,MAX98357AETE+T,2.5-5.5 V supply; bridge-tied class-D output,TQFN-16; 3 x 3 mm plus exposed pad,Selected for Rev B engineering prototype; hardware qualification pending,Imported footprint and numbered pin map reviewed; assembly qualification pending,JLCPCB C910544,https://www.analog.com/media/en/technical-documentation/data-sheets/MAX98357A-MAX98357B.pdf,Base speaker must connect only between OUTP and OUTN. Neither speaker terminal is ground. Available output power depends on SYS rail and distortion target.
U6,1,Head PCB,Constant-current LED boost driver,Texas Instruments,TPS61165DBVR,Six white LEDs in series; about 15 mA nominal with 13.3 ohm sense resistor,SOT-23-6 DBV,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C58756 import,JLCPCB C58756,https://www.ti.com/lit/ds/symlink/tps61165.pdf,Check actual peak LED current including tolerances and thermal derating. Switch-node routing and stable compensation are not validated by the BOM.
U7,1,Head PCB,USB D+/D- ESD protection,STMicroelectronics,USBLC6-2SC6,Two data-line channels; VBUS clamp reference,SOT-23-6L,Selected for Rev B engineering prototype; hardware qualification pending,Frozen catalog footprint; pin map audited,JLCPCB C7519,https://www.st.com/resource/en/datasheet/usblc6-2.pdf,Use the ST part. Pins1/6 share one data net; pins3/4 the other; pin2 ground; pin5 VBUS. Similar names from other manufacturers are not automatically approved.
J1,1,Head PCB,USB-C USB2.0 receptacle,HRO / Korean Hroparts Elec,TYPE-C-31-M-12,16 contacts; power and USB2.0 data,Right-angle SMT plus four plated shell slots,Selected for Rev B engineering prototype; hardware qualification pending,Manufacturer drawing reviewed; custom footprint; stencil/assembly validation pending,JLCPCB C165948,https://en.krhro.com/Product-Details/726.html,"Frozen dependency with explicit pads. Recommended HRO lands/slots used. Procure exact HRO variant, not an unspecified clone. Enclosure must expose the connector mouth."
J2,1,Head PCB bottom,24-contact camera FPC connector,Hirose,FH12-24S-0.5SH(55),24 x 0.5 mm; bottom contacts; 0.3 mm flex,16.1 x 6.4 x 2.0 mm,Selected; sample mating validation pending,Exact JLCSearch footprint and 3D model,JLCPCB C202112,https://www.hirose.com/product/p/CL0586-0521-0-55,Internal inward-facing connector; confirm latch access and pin1. Pads25/26 are grounded hold-downs.
J3,1,Head PCB,Keyed 8-pin head harness connector,JST,B8B-XH-A(LF)(SN),8 pins; 2.50 mm pitch; 3 A with AWG 22,Through hole; 22.4 x 5.75 x 7 mm; mated height 9.8 mm,Selected; sample-fit qualification required,Exact JLCSearch C157972 footprint and supplier CAD,JLCPCB C157972,https://www.jst-mfg.com/product/pdf/eng/eXH.pdf,Mates with XHP-8 and SXH-001T-P0.6. Eight-wire order in base-controls-wiring.csv. Power off before mating.
L1,1,Head PCB,Buck-boost power inductor,Coilcraft,XFL4020-152MEC,1.5 uH; Isat 4.1 A at 10% drop,4 x 4 mm class shielded SMD,Selected for Rev B engineering prototype; hardware qualification pending,Manufacturer drawing reviewed; custom footprint; stencil/assembly validation pending,,https://www.coilcraft.com/getmedia/50632d43-da1b-4cdb-8ab4-3029cab51df3/xfl4020.pdf,"Current rating quoted is saturation criterion, not an unconditional continuous circuit output rating."
L2,1,Head PCB,LED boost inductor,Coilcraft,LPS5030-103MRC,10 uH; Isat 1.4 A at 10% drop; Irms 1 A at 20 C rise,5 x 5 mm class shielded SMD,Selected for Rev B engineering prototype; hardware qualification pending,Manufacturer drawing reviewed; custom footprint; stencil/assembly validation pending,,https://www.coilcraft.com/getmedia/11b17d19-33b4-4b4c-8f03-09560f682bf1/lps5030.pdf,Peak switch current and temperature need bench validation.
D1,1,Head PCB,LED boost Schottky rectifier,onsemi,MBR0540T1G,40 V; 0.5 A,SOD-123,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C21353 import,JLCPCB C21353,https://www.onsemi.com/pdf/datasheet/mbr0540t1-d.pdf,Verify reverse voltage margin and current at maximum LED load before release.
Q1,1,Head PCB,USB VBUS detector NMOS,Nexperia,"2N7002,215",60 V N-channel; gate1/source2/drain3,SOT-23,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C65189 import,JLCPCB C65189,https://assets.nexperia.com/documents/data-sheet/2N7002.pdf,"Low-current logic detector, not the battery load switch."
SW2,1,Head PCB,Head Light momentary button,E-Switch,TL3305AF160QG,Normally open SPST; 160 gf actuation; 50 mA at 12 V rating,4.5 x 4.5 mm body; 3.8 mm height; four 1.6 x 1.6 mm SMT lands,Selected for Rev B engineering prototype; hardware qualification pending,Official land pattern and contact pairs reviewed; standalone netlist/placement checks pass,,https://www.e-switch.com/wp-content/uploads/2023/01/TL3305.pdf,Logical pin1 = physical1+2 lower row; logical pin2 = physical3+4 upper row. Pads at x +/-3.6 mm and y +/-1.4 mm. Assembler must confirm part orientation and enclosure actuator fit.
SW3,1,Clip base lid,Panel-mounted power enable toggle,E-Switch,100SP1T1B1M1REH,SPDT maintained On-On; gold contacts; used at microamp EN current,6.35 mm threaded bushing; 12.7 x 6.86 x 8.89 mm body; solder lugs,Prototype candidate; sample qualification pending,No PCB footprint; dimensioned reference model from manufacturer drawing,DigiKey EG2351-ND,https://configured-product-images.s3.amazonaws.com/Datasheets/100.pdf,Common2 to J3.8; lug1 to J3.2 GND; lug3 NC insulated. Grounded=OFF/charge; open=ON. Not battery isolation.
LED1; LED2; LED3; LED4; LED5; LED6,6,Head PCB bottom,Warm-white reading emitters,XINGLIGHT,XL-3216WWC,2800-3400 K; 20 mA absolute maximum; approximately 15 mA nominal design,1206; 3.2 x 1.6 x 0.8 mm,Selected for Rev B engineering prototype; hardware qualification pending,Manufacturer drawing reviewed; custom footprint; stencil/assembly validation pending,JLCPCB C965830,https://atta.szlcsc.com/upload/public/pdf/source/20250225/5C4852FBB913D8AF4C088570026DA85C.pdf,"Pin1 cathode; pin2 anode. Modest output; total page illuminance, CRI suitability and glare are unqualified. Nominal circuit current is not a guarantee of operating-temperature derating compliance."
LED7,1,Head PCB,Yellow-green power indicator,XINGLIGHT,XL-1608SYGC-06,Compatible with 3.3 V and 1 kohm series resistor,0603,Selected engineering part; hardware qualification pending,JLCSearch exact footprint; pin1 cathode / pin2 anode; board rotation180 degrees,JLCPCB C965805,https://www.lcsc.com/product-detail/C965805.html,"This is a power indication in the present circuit, not a hardware camera-on interlock. Explicit polarity mapping; cathode mark faces board +X. "
LED8,1,Head PCB,Orange charge indicator,XINGLIGHT,XL-1608UOC-06,Compatible with SYS (up to 4.4 V) and 1 kohm series resistor,0603,Selected engineering part; hardware qualification pending,JLCSearch exact footprint; pin1 cathode / pin2 anode; board rotation180 degrees,JLCPCB C965800,https://www.lcsc.com/product-detail/C965800.html,Powered from charger SYS rail; charge indication remains available when the 3.3 V regulator is off. Explicit polarity mapping; cathode mark faces board +X. Catalog pad numbering corrected against manufacturer page7 to agree with silk/fab orientation.
R3; R4,2,Head PCB,Chip resistor,TBD,TBD per value,22 ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R5,1,Head PCB,Chip resistor,TBD,TBD per value,1.78k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned. Sets nominal fast charge current to about 500 mA.
R6,1,Head PCB,Chip resistor,TBD,TBD per value,1.62k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R7,1,Head PCB,Chip resistor,TBD,TBD per value,46.4k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R8; R14; R15; R16; R25; R27,6,Head PCB,Chip resistor,TBD,TBD per value,100k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R9; R10; R11; R12; R13; R18; R19; R26,8,Head PCB,Chip resistor,TBD,TBD per value,10k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R17,1,Head PCB,Chip resistor,TBD,TBD per value,13.3 ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned. Sets LED current: nominal 0.2 V / 13.3 ohm = 15.04 mA.
R20; R21,2,Head PCB,Chip resistor,TBD,TBD per value,470k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned. Battery-divider pair: use matching tolerance and verify ADC calibration.
R22; R23; R35; R36,4,Head PCB,Chip resistor,TBD,TBD per value,1k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R24; R29,2,Head PCB,Chip resistor,TBD,TBD per value,2k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R28,1,Head PCB,Chip resistor,TBD,TBD per value,47k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
C1; C18,2,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,4.7uF; 10 V; X5R or X7R; +/-20% or better,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C2; C4; C5; C10; C15,5,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,10uF; 10 V; X5R or X7R; +/-20% or better,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C3; C7; C8; C9,4,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,22uF; 10 V; X5R or X7R; +/-20% or better,0805,Generic specification; exact MPN pending,Builtin 0805 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C6; C11; C16; C17; C21; C37,6,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,100nF; 10 V; X7R; +/-10%,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C12,1,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,1uF; 10 V; X7R; +/-10%,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C19,1,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,220nF; 10 V; X7R; +/-10%,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C20,1,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,1uF; 50 V; X7R; +/-10%,0805,Generic specification; exact MPN pending,Builtin 0805 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor. LED boost output may reach roughly 20 V during operation; 50 V part specified."
CAM1 (mates J2),1,Head optical assembly,5 MP autofocus sensor/lens on flex,Seeed Studio,114993115,OV5640 5 MP autofocus; 1.8 V DOVDD; 2.8 V analog/AF; internal core,70.5 mm flex; 8.5 x 8.5 mm camera body; supplied heat sink,Selected retail SKU; sample qualification pending,Supplier specifies FH12-24S-0.5SH; exact camera drawing mapped,Seeed 114993115; DigiKey 1597-114993115-ND,https://www.seeedstudio.com/OV5640-Camera-for-XIAO-ESP32S3-Sense-With-Heat-Sink-p-5739.html,Use MJY5OAF-F3M-V1 drawing p3. Pin23 AF ground; pin10 internal core. Verify sample revision/mating/focus and supplied heat-sink envelope. No XIAO board required.
ANT1,1,Rear head antenna tray,2.4 GHz FlexPIFA with supplied coax and MHF1 plug,Ezurio,001-0014,2400-2480 MHz; 50 ohm; 2 dBi nominal peak,40.12 x 11 x 2.5 mm; 41.25 mm including cable edge; 100 +5/-0 mm overall,Selected for engineering prototype; final RF qualification pending,No host-PCB footprint; plugs into U1 built-in U.FL/MHF1 socket,https://www.digikey.com/en/products/detail/ezurio/001-0014/4732758,https://www.ezurio.com/documentation/datasheet-24-ghz-flexpifa,"Adhesive face toward PCB on removable 1.5 mm dielectric tray; radiator faces rear. 3 mm plastic/10 mm metal above; 2 mm plastic/5 mm metal along long sides. Do not substitute MHF4. Sample-check cable OD/bends, connector fit and final enclosed RF performance."
BAT1,1,Clip base,Protected rechargeable lithium-polymer pack,TBD,TBD - qualified protected pack,1S; 3.7 V nominal; 4.2 V charge; 1500-2000 mAh target; >=2 A discharge and >=500 mA permitted charge,Pouch size selected after base CAD,PART SELECTION AND PACK QUALIFICATION PENDING,External; insulated retained cavity; no PCB cell footprint,,https://www.ti.com/lit/ds/symlink/bq24074.pdf,"Require cell protection, verified lead polarity, strain relief and charge-temperature limits compatible with the actual TS thresholds. Do not substitute LiFePO4 or higher-voltage charge chemistry."
NTC1,1,Attached to battery in clip base,Battery temperature thermistor,Semitec,103AT-2,10 kohm at 25 C; 1%; B25/85 approximately3435 K,Insulated remote bead/lead assembly,Thermistor selected; mounting and cell-temperature limits pending,External two leads to J3 pins3 and4,,https://www.ti.com/lit/ds/symlink/bq24074.pdf,TI reference thermistor; direct TS connection gives approximately0-50 C charge window. Confirm chosen cell permits this full range or redesign temperature gating. Thermally bond to cell with electrical insulation; do not put sensor only in the head.
SPK1,1,Clip base,Enclosed speaker,Same Sky,CES-352577-28L200 (candidate),8 ohm; 2 W nominal,35 x 25 x 7.7 mm enclosed; wire leads,CANDIDATE ONLY; base fit/acoustics/output level pending,External; retain and provide sound outlet,,https://www2.sameskydevices.com/catalog/audio/speakers/miniature-%2810-mm~40-mm%29,"Verify exact current manufacturer drawing and available wire length before purchase. Amplifier does not necessarily deliver2 W from the chosen rail; speaker rating is capacity, not promised output."
HARNESS1,1,Through gooseneck,Eight-conductor flex harness,Custom,TBD - assembled wire harness,2 x battery; 2 x twisted speaker; 2 x NTC; 1 x Chat; 1 x power control,Battery22-24 AWG target; speaker/NTC26-28 AWG target; length from mechanical design,CUSTOM ASSEMBLY; flexibility/current/voltage-drop qualification pending,Solder to J3/J4; insulate joints and add strain relief,,,"Wire gauges are prototype starting points. Verify actual neck inner bore, bend radius, temperature and flex life. Keep speaker negative isolated from ground. Measure voltage drop at peak Wi-Fi/audio load. J3 power/NTC/speaker plus J3.7 Chat and J3.8 power. Share J3.2 ground in base; no extra ground conductor. Models use 1.0 mm power and 0.64 mm signal jacket allowances; verify actual wire/current."
PCB1,1,Head PCB,Bare circuit board,Fabricator TBD,Lamp Clip Head Rev B,60 mm round target;4 layers;1.6 mm; double-sided assembly,Custom PCB,ENGINEERING DESIGN; NOT A FABRICATION RELEASE,Routing/stackup/copper/stencil/DFM/reliability qualification pending,,,BOM does not certify manufacturability. Review all project validation reports and unresolved design items before fabrication.
TP1-TP6,6,Head PCB,Bare-copper test pads,PCB feature,No purchased component,1.2 mm pad target,Integrated PCB copper,PCB feature only,No placement item,,,Exclude from assembly purchasing and pick-and-place BOM.
H1; H2; H3; H4,4,Head PCB,M3 mounting clearance holes,PCB feature,No purchased component,3.2 mm non-plated drill,Shared enclosure axes; 6 mm surface keepout diameter,Selected engineering geometry; physical qualification pending,Built drill/post alignment and all-layer clearance checked,,,"Centers (-21,-16), (-20,19), (21,-16), (20,19) mm. Coordinates shared in pcb-mounting.ts."
U8,1,Head PCB bottom,2.8 V camera LDO,Texas Instruments,TLV75528PDBVR,3.3 V input; 2.8 V output; 500 mA device rating,SOT-23-5,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C2868951,https://www.ti.com/lit/ds/symlink/tlv755p.pdf,R34/C32 delay EN after CAM1V8. Scope rail order. Effective input/output capacitance >=0.47 uF; validate loaded rails and dissipation.
U9,1,Head PCB bottom,1.8 V camera I/O LDO,Texas Instruments,TLV75518PDBVR,3.3 V input; 1.8 V output; 500 mA device rating,SOT-23-5,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C2877863,https://www.ti.com/lit/ds/symlink/tlv755p.pdf,"EN=V3V3. Supplies camera pin11, translators and U12. External camera core supply removed; pin10 decoupling only."
U10; U11,2,Head PCB bottom,Dual-supply camera data/sync translators,Texas Instruments,SN74AXC8T245PWR,VCCA3.3 V MCU; VCCB1.8 V camera; DIR1=DIR2=LOW,TSSOP-24 PW,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C882718,https://www.ti.com/lit/ds/symlink/sn74axc8t245.pdf,All channels B-to-A with both direction pins LOW. OE=CAM_PWDN referenced to3.3 V. Both rails bypassed; qualify propagation/skew and ribbon loading.
U12,1,Head PCB bottom,Camera clock/reset/powerdown buffer,Texas Instruments,SN74LVC125APWR,1.8 V supply; inputs tolerate3.3 V,TSSOP-14,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C7813,https://www.ti.com/lit/ds/symlink/sn74lvc125a.pdf,Unused channel disabled/input grounded. Begin XCLK10 MHz; qualify higher rates. R33 series termination after XCLK buffer.
U13,1,Head PCB bottom,SCCB bidirectional translator,Texas Instruments,TXS0102DCTR,VCCA1.8 V; VCCB3.3 V; OE referenced to VCCA,SM8 / DCT,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C324082,https://www.ti.com/lit/ds/symlink/txs0102.pdf,Internal pull-ups; OE follows1.8 V camera RESET_N. Verify SCCB rise times.
C13,1,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,10uF; 10 V; X5R or X7R; +/-20% or better,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C14,1,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,100nF; 10 V; X7R; +/-10%,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
R30; R31,2,Head PCB bottom,Chip resistor,TBD,TBD per value,100k; 1%; >=0.063 W,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,Camera support network; see schematic and source.
R32,1,Head PCB bottom,Chip resistor,TBD,TBD per value,10k; 1%; >=0.063 W,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,Camera support network; see schematic and source.
R33,1,Head PCB bottom,Chip resistor,TBD,TBD per value,33; 1%; >=0.063 W,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,Camera support network; see schematic and source.
C22; C26; C35,3,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per value,4.7uF; 10 V; X7R; effective capacitance per regulator requirements,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,Camera support network; see schematic and source.
C23,1,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per value,1uF; 10 V; X7R; effective capacitance per regulator requirements,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,Camera support network; see schematic and source.
C25; C27; C28; C29; C30; C31,6,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per value,100nF; 10 V; X7R; effective capacitance per regulator requirements,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,Camera support network; see schematic and source.
C24,1,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per value,2.2uF; 10 V; X7R,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,Decouples internal sensor core; never connects to an external voltage source.
C32,1,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per value,1uF; 10 V; X7R,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,AVDD enable delay capacitor; scope sequencing across tolerance.
C33; C34,2,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per value,100nF; 10 V; X7R,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,Local1.8 V bypass for U10/U11 VCCB.
R34,1,Head PCB bottom,Chip resistor,TBD,TBD per value,10k; 1%; >=0.063 W,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,10k with C32 delays camera analog/autofocus enable after1.8 V I/O; scope actual rail order.
SW1,1,Clip base lid,Panel-mounted Chat pushbutton,E-Switch,PV5S24011G,SPST Off-(On); gold contacts; dry logic input,M12 x 1; 17.5 mm bezel; 12.8 mm below bezel including lugs,Prototype candidate; sample qualification pending,No PCB footprint; PV5 family dimensioned reference,https://www.digikey.com/en/products/detail/e-switch/PV5S24011G/4028817,https://configured-product-images.s3.amazonaws.com/Datasheets/PV5.pdf,One lug to J3.7; other to J3.2 ground. M12 panel mount and nut; no base PCB.
C36,1,Head PCB,Chat input filter capacitor,TBD,TBD per value,10nF; X7R; >=10 V,0603,Generic specification; exact MPN pending,Builtin 0603 lands,,,ASK to GND; paired with R35 1k.
J3_CABLE,1,Gooseneck cable / inside head,Polarized eight-position cable housing,JST,XHP-8,8 pins; 2.50 mm pitch; 3 A with AWG 22,JST XH 2.50 mm family,Selected; sample-fit qualification required,No PCB footprint; purchased mating cable hardware,https://www.digikey.com/en/products?keywords=XHP-8,https://www.jst-mfg.com/product/pdf/eng/eXH.pdf,"Thread loose wires through neck before installing contacts into housing. Verify pin 1, crimp pull strength and sample fit."
J3_CONTACTS,8,Gooseneck cable / inside head,XH crimp contact,JST,SXH-001T-P0.6,8 pins; 2.50 mm pitch; 3 A with AWG 22,JST XH 2.50 mm family,Selected; sample-fit qualification required,No PCB footprint; purchased mating cable hardware,https://www.digikey.com/en/products?keywords=SXH-001T-P0.6,https://www.jst-mfg.com/product/pdf/eng/eXH.pdf,"Thread loose wires through neck before installing contacts into housing. Verify pin 1, crimp pull strength and sample fit."
ANT1_TRAY_SCREWS,2,Inside rear head; below antenna tray,M1.6 x 3 pan-head tray screw,TBD,M1.6 x 3,Mechanical retention only,Nominal 3 mm head diameter; 1.2 mm head height,Dimensioned reference; qualify screw and pilot fit,Internal screw; fit tray before PCB,,,Screws face toward PCB and enter blind rear-housing lands; no front-face holes.
PCB_MOUNT_SCREWS,4,Inside head; PCB page side,M3 x 6 button-head machine screws,TBD,M3 x 6; supplier SKU pending,Mechanical retention only,Head <=5.7 mm diameter and <=1.65 mm height,Dimensioned reference; source and sample-fit qualification pending,5.6 mm OD printed posts; tap 2.5 mm blind pilots M3,,,Install before front bezel; 4.4 mm nominal engagement and 1.6 mm tip clearance. Separate from external rear-entry M2 case screws.
U14,1,Head PCB,BC1.2 charger detector and USB data switch,Texas Instruments,BQ24392RSER,5V USB charging-source detection; 500mA charger input mode,10-pin UQFN RSE; 1.5 x 2 mm,Selected; bench validation pending,Exact JLCSearch C128408 copper and CAD,JLCPCB C128408,https://www.ti.com/lit/ds/symlink/bq24392.pdf,Pins 7/8 connector data; 3/2 MCU data; CHG_DET is 5V-domain and only feeds tolerant logic.
U15,1,Head PCB,USB-C sink/current detector,Texas Instruments,TUSB320LAIRWBR,5V USB charging-source detection; 500mA charger input mode,12-pin X2QFN RWB; 1.6 x 1.6 mm,Selected; bench validation pending,Exact JLCSearch C132554 copper and CAD,JLCPCB C132554,https://www.ti.com/lit/ds/symlink/tusb320lai.pdf,GPIO sink mode; internal CC Rd replaces R1/R2; OUT1 low for 1.5A/3A advertisements.
U16,1,Head PCB,Schmitt inverter for CC current detection,Texas Instruments,SN74LVC1G14DBVR,5V USB charging-source detection; 500mA charger input mode,SOT-23-5 DBV,Selected; bench validation pending,Exact JLCSearch C7835 copper and CAD,JLCPCB C7835,https://www.ti.com/lit/ds/symlink/sn74lvc1g14.pdf,Pin2 input; pin4 output; pin3 GND; pin5 USB_LOGIC_3V3; pin1 NC.
U17,1,Head PCB,Three-input OR for charger permission,Texas Instruments,SN74LVC1G332DBVR,5V USB charging-source detection; 500mA charger input mode,SOT-23-6 DBV,Selected; bench validation pending,Exact JLCSearch C43368 copper and CAD,JLCPCB C43368,https://www.ti.com/lit/ds/symlink/sn74lvc1g332.pdf,Pin1 BC_FAST; pin3 CC_FAST; pin6 USB_500MA; pin4 CHG_EN1; pin2 GND; pin5 USB_LOGIC_3V3. 5.5V-tolerant inputs and Ioff required.
U18,1,Head PCB,Independent USB-powered 3.3V logic regulator,Texas Instruments,TLV75533PDBVR,5V USB charging-source detection; 500mA charger input mode,SOT-23-5 DBV,Selected; bench validation pending,Exact JLCSearch C404027 copper and CAD,JLCPCB C404027,https://www.ti.com/lit/ds/symlink/tlv755p.pdf,VBUS supplies IN/EN; works with the base switch OFF; separate from switched V3V3.
R37; R38; R39,3,Head PCB,BC1.2 input ballast,Assembly-house approved,,2.2 ohm; 1%,0402,Value selected; exact MLCC and bias qualification pending,Standard footprint; match rating and effective capacitance,,usb-power-policy.txt,C43/C44 require >=1uF effective capacitance; upsize nominal capacitance if required by supplier curves.
R40,1,Head PCB,CC VBUS_DET series resistor,Assembly-house approved,,887k ohm; 1%,0402,Value selected; exact MLCC and bias qualification pending,Standard footprint; match rating and effective capacitance,,usb-power-policy.txt,C43/C44 require >=1uF effective capacitance; upsize nominal capacitance if required by supplier curves.
R41; R42,2,Head PCB,CC pull-up / charger EN1 pull-down,Assembly-house approved,,10k ohm; 1%,0402,Value selected; exact MLCC and bias qualification pending,Standard footprint; match rating and effective capacitance,,usb-power-policy.txt,C43/C44 require >=1uF effective capacitance; upsize nominal capacitance if required by supplier curves.
C38; C40; C41; C42,4,Head PCB,Detection IC decoupling,Assembly-house approved,,100nF; X7R; 10V,0402,Value selected; exact MLCC and bias qualification pending,Standard footprint; match rating and effective capacitance,,usb-power-policy.txt,C43/C44 require >=1uF effective capacitance; upsize nominal capacitance if required by supplier curves.
C39; C43; C44,3,Head PCB,Detection rail input/output bypass,Assembly-house approved,,1uF; X7R; 10V; >=1uF effective at bias,0603,Value selected; exact MLCC and bias qualification pending,Standard footprint; match rating and effective capacitance,,usb-power-policy.txt,C43/C44 require >=1uF effective capacitance; upsize nominal capacitance if required by supplier curves.