hrithik18k/quad-sensor-conditioner

README.md

# Quad Sense — four-channel sensor conditioner

38 components, 23 nets, 69 routed PCB traces, 19 vias; 80 × 64 mm, two copper layers.

MCP6004-I/P provides four unity-gain buffers. Each input has a 10 kΩ / 100 nF low-pass filter (159 Hz nominal). Closing the channel SLOW jumper adds 1 µF in parallel (14.5 Hz nominal). Each output has a 100 Ω series resistor and 10 nF capacitor. Supply an external regulated 5 V; this board has no regulator, input overvoltage protection, or reverse-polarity protection. Use inputs within the supply rails and high-impedance output loads. The filters assume a low-impedance sensor source.

- J1: 1 = 5 V, 2 = GND.
- JI1–JI4: 1 = 5 V sensor supply, 2 = signal input, 3 = GND.
- JO1–JO4: 1 = conditioned output, 2 = GND.
- JP1–JP4: fit a 2.54 mm shunt for slow filtering.
- U1: MCP6004-I/P, 14-pin PDIP, 7.62 mm row spacing. Pins follow Microchip DS20001733L.
- Resistors/capacitors are top-side 0805, except C2 (1206). Select suitably rated parts; no supplier stock validation or assembly service is implied.

Reference: https://ww1.microchip.com/downloads/aemDocuments/documents/MSLD/ProductDocuments/DataSheets/MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf

## Rebuild

Run `bun install`, then `bun run build`. The source selects the supported `beta_pipeline7` local router. See VALIDATION.md for checks and TSCIRCUIT-ISSUES.md for observed platform issues.

## Fabrication outputs

The unmodified build unexpectedly emits solder paste over through-hole pins. **Do not use the unmodified paste files for a stencil.** Run `python scripts/prepare-fabrication.py`, then export `dist/fabrication.circuit.json` to Gerbers. The script removes only paste entries without SMT-pad references for this board; it does not change copper, holes, or connections. Use `dist/quad-sense-fabrication.zip`, which has the corrected paste layers and explicit assembly BOM. This is a board-specific workaround, not a general-purpose converter fix.

The source and registry preview retain the original platform-generated geometry. Through-hole parts should be soldered conventionally. Pick-and-place supplier orientations remain unverified; the BOM does not specify all orderable passive/header parts. This is a digitally checked prototype, not a physically tested assembly.